摘要
主要研究了等温时效过程中V颗粒对Cu/Sn-58Bi-0.4V/Cu复合钎料焊点界面形态及拉伸性能的影响。结果表明:随着时效时间的增加,Cu/Sn-58Bi/Cu和Cu/Sn-58Bi-0.4V/Cu焊点的微观组织逐渐粗化,IMC层逐渐增厚,且焊点的抗拉强度不断降低;添加0.4%V颗粒有效阻碍了复合钎料焊点微观组织的粗化,抑制了IMC的生长,提高了Cu/Sn-58Bi/Cu焊点的抗拉强度。经断口分析发现,Cu/Sn-58Bi/Cu和Cu/Sn-58Bi-0.4V/Cu焊点断口均表现为脆性断口,但Cu/Sn-58Bi-0.4V/Cu焊点断口表面存在韧窝,表现出一定的韧性。
The effects of V particles on the interfacial morphology and tensile properties of Cu/Sn-58Bi-0.4V/Cu composite solder joint during isothermal aging process are studied.The results show that the microstructures of Cu/Sn-58Bi/Cu and Cu/Sn-58Bi-0.4V/Cu joints gradually coarsen,the IMC layers become thicker and the tensile strength of joints reduce with increasing aging time.However,the addition of 0.4%V particles effectively hinders the coarsening of the microstructures,inhibits the growth of IMC,and improves the tensile strength of Cu/Sn-58Bi/Cu joints.Fracture analysis shows that the fracture surfaces of Cu/Sn-58Bi/Cu are brittle.Some dimples on the fracture surfaces of Cu/Sn-58Bi-0.4V/Cu solder joints are observed,showing a certain toughness.
作者
姜伟
杨莉
张尧成
JIANG Wei;YANG Li;ZHANG Yaocheng(School of Mechanical and Electrical Engineering,Soochow University,Suzhou 215000,China;School of Auto-motive Engineering,Changshu Institute of Technology,Changshu 215500,China)
出处
《电焊机》
2019年第11期53-57,共5页
Electric Welding Machine
