硅通孔转接板关键工艺技术研究——TSV成孔及其填充技术

The research of key technology for trough silicon via interposer-TSV via etching and filling

硅通孔(TSV)转接板的2.5D封装是目前产业界和学术界研究的热点技术,而TSV技术是TSV转接板制造的关键。本文研究了TSV转接板制备工艺,设计了工艺试验并进行了试验研究,对TSV孔刻蚀、阻挡层沉积、电镀填孔、CMP等关键工艺进行了试验研究和讨论,将所有工艺流程整合,完成了TSV转接板样品制备。

2.5D assembly using TSV interposer has been a hotspot in current industry and academy and Silicon Via(TSV) technology has been a key being able technology for TSV interposer manufacture. The preparation technics of TSV interposer is studied, and the technical experiments is designed and studied. TSV via etching, isolation layer deposition, via filling with electroplating, Chemical Mechanism polishing, etc. as key technologies are studied and discussed. All of above technologies have been integrated, and then samples of TSV interposer are made.