一种车载照明封装基板的开发

Development of a new energy vehicle lighting packaging substrate

LED芯片的热流密度更大,对封装基板材料热阻和膨胀系数的要求也越来越高。散热基板发展迅速,品种也比较多,目前主要有金属基印刷电路板、金属基复合材料,用来强化散热效果。作为一种新型的散热基板,AIN陶瓷封装基板稳定性好,可能是最有前景的研究方向。与金属材料封装基板相比,其省去绝缘层的复杂制作工艺,陶瓷基板封装(MLCMP)技术在热处理方面与传统封装方法相比有大幅度的改善。

The thermal resistance and expansion coefficient of LED chips packaging substrate material should be improved. A variety of heat dissipation substrates have been produced due to the rapid development of technology in which metal-based printed circuit boards and metal-based composite materials are better in enhancing the heat dissipation effect currently. As a new kind of heat dissipation substrate AlN ceramic packaging substrate has good stability, which may be the most promising research direction. Compared with metal packaging substrates, the complex fabrication process of insulating layer is omitted and MLCMP technology improves better in heat treatment in comparison with the traditional packaging methods.