氧化铝陶瓷表面化学镀铜无钯活化新工艺

A New Palladium-Free Activation Technology for Alumina Ceramic Surface Electroless Copper Plating

研究了一种氧化铝陶瓷化学镀铜无钯活化新工艺。将基体放入CuSO4和NaH2PO2的混合溶液中进行超声波浸润,然后通过热处理实现基体表面的无钯活化。通过正交试验,确定了活化的最佳工艺条件为:CuSO4 20 g/L,NaH2PO2 80 g/L,超声波浸润时间2 min,活化温度145℃,活化时间10 min。此时镀层覆盖率达到100.0%。经高温活化后,基体表面附着一层均匀的、平均直径为40 nm的铜微粒。施镀后,化学镀铜层完全覆盖基板,组织均匀,结合力良好。

A new palladium-free activation technology for alumina ceramic surface electroless copper plating was studied. The substrate was immersed in a mixed solution of CuSO4 and NaH2PO2 for ultrasonic-assisted infiltration, and then the surface of the substrate was activated without palladium by heat treatment. Through the orthogonal experiment, the optimal process conditions for activation were determined as follows: CuSO4 20 g/L, NaH2PO2 80 g/L, ultrasonic infiltration time 2 min, activation temperature 145 ℃, activation time 10 min. The coating coverage rate reached 100.0% under the optimal process conditions. The results showed that after high temperature activation, the surface of the substrate was uniformly coated with copper particles with an average diameter of 40 nm. After electroless copper plating, the coating completely covered the substrate, showing uniform structure and good binding force.