巴基纸/SMP复合材料热传导性能有限元模拟

Finite-element simulation on thermal conductivity of BP/SMP composites

为了对巴基纸/形状记忆聚合物复合材料中巴基纸埋入方式、尺寸参数和加热工况进行优化设计,本文采用FLUENT软件分析了不同形状巴基纸/形状记忆聚合物复合材料达到稳态时温度分布规律和加热效果。计算结果表明:加热达到稳态时,矩形弯曲巴基纸/形状记忆聚合物复合材料温度相对较低,但是加热更均匀。相同单位体积内热源作用下,平板形巴基纸/形状记忆聚合物复合材料典型温度值均低于矩形弯曲巴基纸/形状记忆聚合物复合材料。形状记忆聚合物基体的导热系数越大,巴基纸/形状记忆聚合物复合材料加热达到稳态时最低温度也呈增大趋势,但是最高温度和平均温度则呈降低趋势,因而温度分布更加均匀。巴基纸厚度越小,巴基纸/形状记忆聚合物复合材料达到稳态时温度越高。分析认为:巴基纸的单位体积内热源越小,形状记忆聚合物基体的导热系数越大,巴基纸/形状记忆聚合物纸基复合材料达到稳态时温度越低,温度分布越均匀。

The temperature distribution and heating effect of composites reinforced by different shaped buckypaper/shape memory polymer(BP/SMP)composites were analyzed using the software FLUENT to optimize the embedding mode,the dimension parameters of BP,and the heating conditions of BP/SMP composites.The calculation results show that the temperature of the SMP composites reinforced by pulse-bending BP is relatively low when the composites are reaching the steady state and that the temperature distribution is more uniform.Under the same internal heat source per unit volume,the typical temperature of the flat BP/SMP composites reinforced by line BP is lower than that of the SMP composites reinforced by pulse-bending BP.The greater the thermal conductivity of the SMP matrix,the higher the minimum temperature when the BP/SMP composites reach steady state.However,the maximum temperature and average temperature tend to decrease;therefore,the temperature distribution is more uniform.The smaller the thickness of BP,the higher the temperature of BP/SMP composites when they are reaching the steady state.The results show that the smaller the heat source per unit volume,the larger the thermal conductivity of SMP matrix,the lower the temperature of BP/SMP composites,and the more uniform the temperature distribution of BP/SMP composites when they are reaching the steady state.