某电源芯片μ via开裂失效分析及风险评估

Failure Analysis and Risk Assessment of an Power Chip μ via Crack

该文介绍一种新型封装电源芯片的一种失效模式--μvia开裂,通过多种失效分析手段确定了其失效原因,并给出了相应的改进措施。另外,还通过温度循环加速试验进行风险评估,结合Weibull分布及Coffin-Manson加速模型,给出了该电源芯片的长期应用风险。

This document introduces a failure mode of a new type of packaged power chip-μvia cracking.Perfrom failure analysis by a variety of failure analysis methods to find the root cause and provide corresponding improvement actions.In addition,thermal cycle acceleration test is carried out to perform risk assessment.Based on the Weibull distribution and the Coffin-Manson acceleration model,the long-term application risk of this power chip is given.