小尺寸器件气密性封装工艺的水汽控制

Water Vapor Control of Hermetic Packaging Process for Small Size Devices

随着对产品可靠性要求和检测技术的提高,对小尺寸器件的水汽控制提出了明确要求。本文分析了水汽偏高的原因,提出了小尺寸器件水汽控制的技术要点,设计了金锡合金封装工艺方法。选用金锡合金预成型焊环作为封装材料,通过大量试验摸索出一种较佳的封装工艺控制程序,有效解决了小尺寸器件的水汽控制问题,保证了产品的电性能和可靠性。

With the improvement of requirements of products for reliability and detection technologies,the water vapor control of small size devices is also required clearly.The reasons of high water vapor are analyzed,the technical points of water vapor control for small size devices are put forward,and the gold-tin-alloy packaging process is designed.With the pre-formed gold-tin-alloy welded rings selected as the packaging materials,a better packaging process control method is explored by means of a lot of experiments,which can effectively solve the problem of water vapor control of small size devices and ensure the electrical performance and reliability of the products.