摘要
调制脉冲磁控溅射可通过改变强、弱离化阶段的脉冲强度和占空比等电场参量,大幅调控镀料粒子的离化率、沉积能量和数量,实现对沉积镀层形核与生长过程的精确把控。在非平衡闭合磁场条件下,采用调制脉冲磁控溅射技术,通过对其强离化脉冲阶段的脉冲宽度和靶功率进行调控获得持续增大的峰值靶功率密度,并在此条件下制备多组纯Ti镀层,对其微观形貌和力学性能进行了检测分析。结果表明,当强离化脉冲阶段的峰值靶功率密度由0.15 k W·cm^-2持续增大至0.86 k W·cm-2时,所制备的纯Ti镀层具有11 nm的平均晶粒尺寸,且较其他峰值靶功率密度条件下的制备镀层具有更为致密的组织结构、平整的表面质量(表面粗糙度Ra为11 nm)和良好的力学性能。
Modulated pulsed power magnetron sputtering(MPPMS)has the ability to control the ionization rate,energy and quantity of deposited particles through adjusting the pulsed intensity and duration,thus modifying the nucleation and growth process of the thin film.Nanocrystalline Ti films were deposited using MPPMS technique in a closed field unbalanced magnetron sputtering(CFUBMS)system under different peak target power densities of the strong-ionized period(Pd).The modulated pulse power(MPP)was employed to modify the Pd by varying the pulse lengths and the average target powers.The results show that the nanocrystalline Ti film with a grain size of 11 nm exhibits a dense microstructure and a smooth surface(roughness of 11 nm)when the Pd is 0.86 k W·cm^-2.The improved properties of the as-prepared Ti film were also discussed.
作者
杨超
蒋百灵
王迪
黄蓓
董丹
Yang Chao;Jiang Bailing;Wang Di;Huang Bei;Dong Dan(Xi’an University of Technology,Xi’an 710048,China)
出处
《稀有金属材料与工程》
SCIE
EI
CAS
CSCD
北大核心
2019年第11期3433-3440,共8页
Rare Metal Materials and Engineering
关键词
纳米晶
Ti镀层
调制脉冲磁控溅射
峰值靶功率密度
nanocrystalline
Ti film
modulated pulsed power magnetron sputtering
peak target power density