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冷喷涂和低压等离子喷涂Ni-Ti涂层:组织和性能 被引量:4

Microstructures and Key Properties of Cold Sprayed and Low-pressure Plasma Sprayed Ni-Ti Coatings
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摘要 采用原子比1:1的Ni和Ti为原料,通过冷喷涂(CS)和低压等离子喷涂(LPPS)制备了Ni-Ti复合涂层,研究喷涂工艺对涂层的组织(孔隙率、相组成和显微组织)和性能(硬度、耐磨性和耐蚀性)的影响。结果表明:2种涂层均未发生明显的氧化,但表现出不同的组织结构。高速碰撞后的颗粒发生严重塑性变形使CS涂层具有低的孔隙率,且XRD未检测到其它的生成相;层片状结构的LPPS涂层内部形成了Ni-Ti金属间化合物相,其表现出高的显微硬度和低的磨损率。此外,LPPS涂层呈现高的腐蚀电位和低的腐蚀电流密度,表明其具有高的耐蚀性。 Ni-Ti composite coatings were prepared by cold spray(CS)and low-pressure plasma spray(LPPS)using a mechanically mixed powder of Ni/Ti at the atomic ratio of 1:1.Upon utilization CS and LPPS techniques,spray processes played a significant role in the microstructures,phase compositions,mechanical property,and wear and corrosion performances of the two coatings.The results show that no oxidation is characterized in these two coatings.Nevertheless,two very different coating structures are found.CS coating shows a much lower porosity and a mechanical bonding of plastically deformed particles,and XRD denotes no NiTi intermetallic is formed during CS deposition.However,high temperature can lead to the significant differences in the LPPS coating,which exhibits a lamellar structure with the formation of Ni-rich and Ti-rich intermetallics around the interface.The LPPS coating presents the excellent performances due to the element diffusion during LPPS process,such as a higher hardness value,which is nearly three times higher than that of CS coating,and a lower wear rate.In addition,the coating also exhibits a much higher corrosion potential and a much lower corrosion current,indicating its better corrosion resistance.
作者 刘顺 罗杰 陈衡 魏绍明 黄春杰 Liu Shun;Luo Jie;Chen Heng;Wei Shaoming;Huang Chunjie(CGN Inspection Technology Co.,Ltd,Suzhou 215004,China;UniversitéBourgogne Franche-Comté,Belfort 900101,France)
出处 《稀有金属材料与工程》 SCIE EI CAS CSCD 北大核心 2019年第11期3621-3627,共7页 Rare Metal Materials and Engineering
基金 国家重点研发计划(2018YFB1106100)
关键词 冷喷涂 低压等离子喷涂 Ni-Ti涂层组织 摩擦磨损行为 电化学腐蚀行为 cold spray low-pressure plasma spray Ni-Ti coating microstructure tribological behavior electrochemical behavior
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