螺旋藻基化学镀镍的工艺研究

Study on Electroless Nickel Plating on Spirulina

随着时代的发展和科技水平不断进步,各种高科技含量的电子产品不断涌现,导致电磁辐射在人们的生活中无处不在,所以对屏蔽材料的研制成为热点。以螺旋藻为基体,采用化学镀的方法制备了一种具有螺旋结构的金属镍微粒。研究出制备镍包螺旋藻的工艺:首先用2.5%戊二醛在4℃下固定5 h,过滤出螺旋藻进行水洗(去离子水一次),固定完成后进行螺旋藻的前处理,将螺旋藻用胶体活化液在25℃下活化20 min,然后进行洗胶,洗胶完成后使用还原剂在25℃下还原20 min,最后将前处理完成的螺旋藻在25℃下化学镀30 min;经过此工艺后制得表面有均匀镍镀层的螺旋藻。螺旋藻特殊的螺旋结构可以有效地改变无机物和有机物之间的界面状态,提高镍系导电涂料在低频区和高频区的电磁屏蔽性能。

With the development of the times and the progress of science and technology,various hightech electronic products are emerging,which leads to the ubiquitous electromagnetic radiation in people's lives.Therefore,research on shielding materials has become a hot topic.In this paper,a kind of metal nickel particle with helical structure was prepared by electroless plating on spirulina plating.The preparation process of nickel package of spirulina was studied.Firstly,using 2.5% glutaraldehyde fixation under 4℃ for 5 h,the spirulina was filtered in water(deionized water)at a time.The pretreatment of spirulina was carried out after fixation.Spirulina was activated with colloidal activation solution at 25℃ for 20 min,and then rinsed.After rinsing,a reducing agent was used to reduce spirulina at 25℃ for 20 min.Finally,the treated spirulina was electroless plated at 25℃ for 30 min;After this process,spirulina with uniform nickel coating was prepared.The special helical structure of spirulina can effectively change the interface state between inorganic and organic matter and improve the electromagnetic shielding performance of nickel conductive coatings in low and high frequency areas.