基于质量控制方法的薄膜微带电路电镀自动化装备研制

Development of thin film microstrip circuits electroplating automation equipment based on quality control methods

为规避薄膜微带电路电镀过程中操作者误接触和误吸入危险化学品的风险,确保电镀产品质量一致性,提高生产效率,顺应当前自动化、智能化制造的形势,小组运用质量控制理论和方法,提出各种设计方案,并通过仿真、试验等进行方案筛选,针对最佳方案制定对策并逐一实施、确认,完成薄膜微带电路电镀自动化装备的研制任务。

In order to avoid the risk of accidental contact and inhalation of hazardous chemicals by operators in the process of thin-film microstrip circuit electroplating, and to ensure the quality consistency of electroplating products, improve production efficiency, and comply with the current situation of automation and intelligent manufacturing, the paper puts forward to various design schemes by using the theory and methods of quality control such as simulation, test and other methods. We have worked out the Countermeasures for the best scheme, implemented and confirmed one by one, and finally completed the development task of the thin film microstrip circuit electroplating automation equipment.