三维集成微系统散热微通道均温性研究

Investigation on Microchannel Temperature Uniformity Performance for 3D Integrated Microsystem

针对微通道流体流动方向壁温温度梯度较大、热失配应力较大,从而导致三维集成微系统可靠性降低的问题,以数值计算的方式分析在不同流速(0.3~0.7 m/s)下4种热沉结构的均温特性。研究结果表明:混合式微通道热沉(H-MCHS)均温性最好,入口流速Vin=0.3 m/s时,壁温标准差σ=2.09 K。增加入口流速可改善均温性,流速从0.3 m/s增加到0.7 m/s时,H-MCHS壁温标准差σ减小50.70%。

The wall temperature gradient along the microchannel fluid flow direction and the thermal mismatch stress are larger,which leads to the problem of reducing the reliability of the three-dimensional integrated micro system.Four kinds of thermal sink structures at different flow rates 0.3~0.7 m/s were numerically analyzed.The results show that the hybrid microchannel heat sink(H-MCHS)has the best temperature uniformity.When the average flow rate of the inlet is 0.3 m/s,the standard deviation of wall temperature is 2.09 K.Increasing the inlet flow rate improves the performance of temperature uniformity.The standard deviation of H-MCHS wall temperature is reduced by 50.70%when the flow rate is increased from 0.3 m/s to 0.7 m/s.