非接触测量仪在减薄设备中的应用研究

Application and Development of Non-contact Measuring Instrument in Thinning Equipment

为满足超薄晶圆加工实时在线检测磨削厚度、确保晶圆加工质量的需要,提出了采用非接触测量仪进行实时在线检测。研究表明,非接触测量可以提高超薄晶圆磨削的表面加工质量,避免了接触式测量可能导致晶圆表面损伤的风险,而且应用领域广泛,应用优势明显,发展前景良好。

In order to meet the needs of on-line monitoring and control of ultra-thin wafer processing to monitor the grinding thickness in real time and ensure the quality of wafer processing,a non-contact measuring instrument is used to detect wafer thickness on-line in real time to improve the surface processing quality of ultra-thin wafer grinding. Study shows,the contact measuring instrument may cause the risk of wafer surface damage,and has a wider range of application fields,which has obvious application advantages and good development prospects.