摘要
为满足超薄晶圆加工实时在线检测磨削厚度、确保晶圆加工质量的需要,提出了采用非接触测量仪进行实时在线检测。研究表明,非接触测量可以提高超薄晶圆磨削的表面加工质量,避免了接触式测量可能导致晶圆表面损伤的风险,而且应用领域广泛,应用优势明显,发展前景良好。
In order to meet the needs of on-line monitoring and control of ultra-thin wafer processing to monitor the grinding thickness in real time and ensure the quality of wafer processing,a non-contact measuring instrument is used to detect wafer thickness on-line in real time to improve the surface processing quality of ultra-thin wafer grinding. Study shows,the contact measuring instrument may cause the risk of wafer surface damage,and has a wider range of application fields,which has obvious application advantages and good development prospects.
作者
白阳
刘文平
王仲康
BAI Yang;LIU Wenping;WANG Zhongkang(The 45th Research Institute of CETC,Beijing 100176,China;Pingliang Information Engineering School,Pingliang 744000,China)
出处
《电子工业专用设备》
2019年第6期50-53,64,共5页
Equipment for Electronic Products Manufacturing
关键词
非接触测量
测量仪
晶圆减薄
Non-contact measuring
Measure instrument
Wafer grinding