摘要
像素级数字化红外探测器具有更高的性能水平和更强的抗干扰能力,是红外探测器技术发展的重要方向之一。通过突破像素级数字化读出电路设计、低峰谷碲镉汞材料外延、器件制备工艺以及倒装互连等关键技术,研制出了一种512×8像素级数字化长波红外探测器组件,并对其性能进行了测试。此探测器的响应波段为7.85~10.17 m,平均峰值响应率为1.4×1011 LSB/W,响应率非均匀性为9.13%,有效像元率为97.5%,噪声等效温差(Noise Equivalent Temperature Difference,NETD)为4.4 mK,动态范围为90.6 dB。测试结果表明,该探测器能够满足系统要求。
The pixel-level digital infrared detector has higher performance and anti-interference ability,which is one of the important directions of infrared detector technology development.By breaking through key technologies such as pixel-level digital readout circuit design,low peak-valley HgCdTe material epitaxy,device fabrication process,and flip-chip connection,a 512×8 pixel-level digital long-wave infrared detector assembly is developed,and its performance is tested.The results show that this detector assembly can meet the system requirements,with spectral response range of 7.85--10.17 m,average peak responsivity of 1.4×1011 LSB/W,responsivity non-uniformity of 9.13%,operable pixel factor of 97.5%,noise equivalent temperature difference(NETD)of 4.4 mK and dynamic range of 90.6 dB.
作者
李忠贺
康健
王成刚
张敏
陈彦冠
胡尚正
周立庆
吴卿
袁媛
LI Zhong-he;KANG Jian;WANG Cheng-gang;ZHANG Min;CHEN Yan-guan;HU Shang-zheng;ZHOU Li-qing;WU Qing;YUAN Yuan(North China Research Institute of Electro-Optics,Beijing 100015,China)
出处
《红外》
CAS
2019年第9期1-5,共5页
Infrared