摘要
通过超声法将炭黑(CB)粒子固定在静电纺丝尼龙6(PA6)纤维膜表面,制备出一系列具有不同CB含量的CB/PA6导电纤维薄膜。利用热压成型法将制备的导电纤维膜与高密度聚乙烯(HDPE)粉末热压复合,制备出CB/PA6/HDPE导电高分子复合材料(CPC)。扫描电子显微镜图片显示,CB粒子均匀地锚固在PA6纤维表面,且CB/PA6导电纤维膜在HDPE基体中形成连续的导电网络结构。研究了材料的导电逾渗行为,发现CB/PA6/HDPE复合材料的逾渗值仅为2.5%,显著低于传统的CB/HDPE复合材料的逾渗值(8.5%)。同时,由于CB/PA6/HDPE复合材料具有特殊的预制CB/PA6导电纤维网络状结构,PA6电纺纤维膜的含量在复合材料体系中也呈现出有趣的逾渗行为。
A series of carbon black(CB)/polyamide 6(PA6) conductive nanofiber mats with different CB concentrations were fabricated by anchoring CB particles onto electrospun PA6 nanofibers through powerful ultrasonication. The nanofiber mats were then embedded into the high density polyethylene(HDPE) powder matrix to prepare CB/PA6/HDPE conductive polymer composites(CPC) by hot press molding. Scanning electron microscope(SEM) images reveal that the CB particles are strongly attached to the surface of PA6 nanofibers homogeneously, and the CB/PA6 conductive fibers mats constructed continuous conductive networks in the HDPE matrix. It can be seen from the percolation curves that the percolation threshold value of CB/PA6/HDPE composites is 2.5%, which is much lower than that of the conventional CB/HDPE(8.5%) CPC. It is noteworthy that an interesting percolation behavior of PA6 fibers content can be observed in CB/PA6/HDPE composites, which is ascribed to the special pre-fabricated CB/PA6 fibrous conductive network structure.
作者
周明博
李朝阳
李勇
代坤
刘春太
Mingbo Zhou;Zhaoyang Li;Yong Li;Kun Dai;Chuntai Liu(School of Materials Science and Engineering,Tianjin University,Tianjin 300350,China;Catarc(Tianjin)Automotive Engineering Research Institute Co.,Ltd.,Tianjin 300300,China;College of Civil Engineering and Architecture,Shangqiu Normal University,Shangqiu 476000,China;School of Materials Science and Engineering,National Engineering Research Center for Advanced Polymer Processing Technology,Zhengzhou University,Zhengzhou 450002,China)
出处
《高分子材料科学与工程》
EI
CAS
CSCD
北大核心
2019年第11期150-154,160,共6页
Polymer Materials Science & Engineering
基金
国家自然科学基金资助项目(51603193)
关键词
静电纺丝
炭黑
导电高分子复合材料
逾渗行为
electrospinning
carbon black
conductive polymer composite
percolation behavior