宇航印制板组件上塑封器件的灌封工艺

Potting Technology of Plastic Packaging Devices on Astronavigation PCBA

以宇航印制板组件上某分层塑封器件为研究对象,按照灌封标准要求,选用了GN521有机硅凝胶为灌封材料,开展灌封工艺研究,最终确定了灌封的工艺流程与参数,重点解决了工装设计、固定和真空脱泡等关键技术。通过对灌封后的印制板组件样件的高/低温冲击试验结果进行分析,验证了该灌封工艺技术的有效性。

Taking a laminated plastic packaging device on the aerospace PCBA as the research object, according to the requirements of potting standard, GN521 silicone gel is chosen as the potting material, and the potting process is studied. Finally, the potting process and parameters of the encapsulation are determined, and the key technologies such as fixture design, fixation and vacuum defoaming are mainly solved. Through the analysis of the high/low temperature shock test results of the potted PCB components, the effectiveness of the potting technology is verified.