KrF激光刻蚀制备300 nm自支撑聚酰亚胺膜

Preparation of 300 nm PI Self-supporting Film Using KrF Laser Ablation

本工作探讨了微纳米量级聚酰亚胺(PI)自支撑薄膜的制备。以4,4′-二氨基二苯醚(ODA)和均苯四甲酸二酐(PMDA)为单体合成聚酰胺酸(PAA)溶液。经热亚胺化后脱膜得到厚度为900 nm的自支撑PI薄膜。亚胺化程度用傅里叶变换红外光谱仪(FT-IR)测试,表面形貌用透射式显微镜观测。结果显示,在低于250℃下制备的ZnO薄膜适合作为脱膜剂;采用KrF准分子激光对薄膜刻蚀,当能量密度为45 mJ/cm^2时刻蚀110个脉冲,得到了表面平整且厚度为300 nm的自支撑PI薄膜。

To discuss the preparation of micro-nano polyimide(PI)self-supporting film,polyamic acid(PAA)solution were synthesized by using pyro-mellitic dianhydride and 4,4′-oxydianiline as monomers.Then 900 nm self-supporting PI film acquired through thermal imidization and demolding.Degree of imidization was investigated with Fourier transform infrared(FT-IR)spectroscopy,surface morphology was observed by projective microscope.Results showed that ZnO thin film sputtered less than 250℃ was the optimum demolder and KrF excimer laser(wavelength:248 nm)etched PI film 110 pulses at 45 mJ/cm^2 laser fluence,300 nm self-supporting PI film would be acquired.