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新型无氨无氯钯镍合金电镀液的应用研究

Research on brand new ammonia-free and chlorine-free Pd-Ni alloy
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摘要 电镀钯镍合金是一种新型的印制电路板表面涂饰工艺,性能优异,可满足终端多样化需求。文章针对一款环境友好的无氨无氯钯镍合金电镀液进行系列研究,确认相关因子对钯镍合金中钯含量控制、镀层品质等的影响,最终获得良好的合金镀层,实现该工艺在印制电路板加工中的量产化应用。 As one of final surface finishes used in printed circuit board(PCB),electroplating palladium and nickel(Pd&Ni)alloy is brand new and excellent which can meet the end users’diverse demands.We have done a lot of research on this brand new eco-friendly fast-plating Pd&Ni alloy electrolyte,which is ammonia-free and chlorinefree.This article mainly elaborates on all the potential factors’impact on the Pd content and plating quality,which are playingkey roles in the high performance plating.Right now,this brand new fast-plating Pd&Ni alloy electrolyte has been applied in PCB mass production as final surface finish.
作者 杨晓新 杨海永 Yang Xiaoxin;Yang Haiyong
出处 《印制电路信息》 2019年第12期27-31,共5页 Printed Circuit Information
关键词 印制电路板 钯镍合金 电镀 表面处理 钯含量 Printed Circuit Board Palladium-Nickel Alloy Electroplating Surface Finish Palladium Content
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  • 1Whitlaw K J. Gold flashed palladium nickel for electronic contacts[J]. Trans IMF, 1986,64(2) :62-67.
  • 2AbysJ A, Kudrak E J, Maisano J J, et al. The electrodeposition and material properties of palladium-nickel alloy: Conference Proceedings WESCON/96 [ C ]. US: [s. n. ], 1996.. 377-386.
  • 3Toben M P, Martin J L, Russo R A. Palladium-nickel electrodeposits- Properties and selection: AESF Sur/Fin Conference Proceedings[C]. US:[s. n. ], 1997:353-354.
  • 4电镀污染物排放标准.GB21900-2008中国标准书号[S].北京:中国标准出版社,2008.
  • 5YamamuraK. Palladium-nickel alloy plating bath: US, 3 580 820[P]. 1971.
  • 6Obermeier F K,Rizzo A. Bath for electroplating with hard, ductile palladium-nickel alloy: DE 2 328 243[P]. 1975.
  • 7沈宁一 吴莲花 杨孟权.印刷线线路板代金镀层-电镀钯合金.电镀与环保,1985,5(1):5-8.
  • 8Heppner K D, Shuster H J. Ammonia-free palladium electroplating bath using aminoacetic acid: US, 4 242 180 [P]. 1980.
  • 9BAR G, D. RUHLICKE D. Galvanischer Schichwerbtundwerkstoff Ni/PdNi/Au fur elektrotechnische Anwendungen [J]. Metall, 1991, 45 (7): 668-673.
  • 10SIMON F. Palladium-Nickel start Gold [J]. MetaUoberflache, 1999, 53 (1): 30-33.

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