摘要
印制电路板耐导电阳极丝(CAF)性能是影响产品可靠性的重要因素。本文是简述了CAF失效机理,以及产生CAF失效的条件和模式,并分析了常规几种耐CAF影响因素,进而提出具体耐CAF测试方法,以评估印制电路板设计、材料选型及其它材料加工特性对耐CAF测试方法结果的影响。
The performance of conductive anodic filament(CAF)is an important factor affecting the reliability of printed circuit board.This paper describes the failure mechanism of CAF,and the conditions and modes of CAF failure,and the factors affecting CAF tolerance.The concrete test method of CAF resistance was proposed.The influence of PCB design,material selection and other material processing characteristics on CAF withstanding test results were evaluated.
作者
陈庆国
晋晓峰
陈苑明
何为
Chen Qingguo;Jin Xiaofeng;Chen Yuanming;He Wei
出处
《印制电路信息》
2019年第12期35-38,共4页
Printed Circuit Information
