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Some new mesoscopic crossover length scales concerning the Hamaker constant

Some new mesoscopic crossover length scales concerning the Hamaker constant
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摘要 The last three decades have witnessed a global surge in nano-and micro-mechanics driven by the rapid development of nanotechnology,microelectromechanical systems(MEMS)and nanoelectromechanical systems(NEMS)[1].Although a generally accepted framework is still lacking for mesoscopic mechanics,four broad categories of viewpoints have been agreed upon[2]:(1)Continuum mechanics works quite well even for a few atoms in diameter.In 1997,Richard E.Smalley(1943-2005),the late Nobel laureate,and Yakobson[3]once commented:“The behavior of the hollow tubules is complex,but still predictable with continuum-elastic methods.In its applications to nanotubes,the correspondence between the elastic model and molecular dynamics is remarkable.The laws of continuum mechanics are amazingly robust and al-low one to treat even intrinsically discrete objects only a few atoms in diameter.”
作者 ZHAO YaPu
出处 《Science China(Technological Sciences)》 SCIE EI CAS CSCD 2019年第12期2310-2312,共3页 中国科学(技术科学英文版)
基金 supported in part by the National Natural Science Foundation of China(Grant No.51861145314,11872363) the Chinese Academy of Sciences(CAS)through the CAS Key Research Program of Frontier Sciences(Grant No.QYZDJ-SSW-JSC019) the CAS Strategic Priority Research Program(Grant No.XDB22040401)
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  • 1Gang Sun~(1,2), Yan Fang~(1,2), Qian Cong~1, Lu-quan Ren~11. Key Laboratory of Terrain-Machine Bionics Engineering (Ministry of Education, China), Jilin University,Changchun 130022, P. R. China2. School of Life Science, Changchun Normal University, Changchun 130032, P. R. China.Anisotropism of the Non-Smooth Surface of Butterfly Wing[J].Journal of Bionic Engineering,2009,6(1):71-76. 被引量:10
  • 2Zhang L X and Zhao Y P 2003 Microsyst Technol. 9 420.
  • 3Hornbeck L J 1991 US Patent 5061049.
  • 4Dequesnes M, Rotkin S V and Aluru N R 2002 Nanotechnol.13 120.
  • 5Rotkin S V 2002 Electrochem. Society Proc. 6 90.
  • 6vPelesko J A 2001 Proc Modelling and Simulation of Microsystems Conf. (MSM 2001) 290.
  • 7Bernstein D, Guidotti P, Pelesko J A 2000 Proc Modelling and Simulation of Microsystems Conf. (MSM 2000) 489.
  • 8Sapmam S, Blanter Y M, Gurevich L and van der Zant H SJ 2003 Phys Rev. B 67 235414.
  • 9Zhao Y P, Wang L S and Yu T X 2003 J Adhesion Sci Technol. 17 519.
  • 10Zhao Y P and Li W J 2002 Chin Phys Lett. 19 1161.

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