谐振式MEMS压力传感器的设计与分析

Design and Analysis of Resonant MEMS Pressure Sensor

提出一种基于静电激励/压阻检测的硅微谐振式压力传感器,该器件采取面内动平衡的振动模式,为了抑制压力敏感膜片受压变形时谐振器的高度变化,在谐振器固定端设计了悬置扭转结构。根据对传感器数学模型的分析与建立,并利用MEMS有限元仿真软件对传感器在0~120 kPa范围以及全范围过压1.5倍下进行模拟分析与仿真验证,初始频率为24.01 kHz,传感器灵敏度达18 Hz/kPa。利用硅-硅键合技术实现压力传感器的真空封装,并通过TSV通孔技术将传感器与电路芯片进行三维混合集成封装。

A silicon micro resonance type pressure sensor based on electrostatic excitation/piezoresistive detection was proposed.The device adopted the vibration mode of in-plane dynamic balance.In order to suppress the height change of the resonator when the pressure-sensitive diaphragm was deformed,suspension torsion structure for fixed end of the resonator was designed.According to the analysis and establishment of the mathematical model of the sensor,the simulation analysis and simulation verification of the sensor in the range of 0~120 kPa and full-scale of 1.5 times were carried out by MEMS finite element simulation software.The initial frequency is 24.01 kHz,and the sensor sensitivity was 18 Hz/kPa.The silicon-silicon bonding technology was used to realize vacuum encapsulation of the pressure sensor,and the sensor and the circuit chip were three-dimensionally mixed and integrated and packaged through the TSV through-hole technology.