摘要
本文描述了一款集成电路OP200在光刻过程多余物剔除不干净的情况下导致的失效模式,并针对此缺陷进行了失效分析和试验验证。
This paper describes the failure mode of an integrated circuit OP200 under the condition of unclean removal of superfluous objects in the photolithography process,the failure analysis and test verification are carried out for this defect.
作者
赵卫国
李翔
Zhao Weiguo;Li Xiang(Tianshui Productivity Promotion Center,Tianshui Gansu,741000;Gansu Electric Power Research Institute,Tianshui Gansu,741000)
出处
《电子测试》
2020年第3期40-42,共3页
Electronic Test
