摘要
对平面埋置电容多种型号基板材料进行了性能及特点介绍。运用传统FR-4基板制造技术,结合挠性基板制造特点,针对实现平面埋容多层印制电路板加工技术,进行了阐述。
In the modem communication design the performance and characteristics of many kinds of planar capacitor laminates are introduced. Using traditional FR-4 substrate manufacturing technology combining with the characteristics of flexible base board manufacturing the processing technology to achieve capacitor buried multilayer Printed Circuit Board is explained.
出处
《印制电路信息》
2020年第1期32-39,共8页
Printed Circuit Information
关键词
平面电容基板
埋置电容
制造工艺
Planar Capacitor Lami nate
Embedded Capacitor
Processing Tech nology
