摘要
文章概述了信号传输高频化给PCB的“孔”、“线”和“层”等科目带来的发展与进步。目前和今后,PCB的“孔”的加工和质量将主导着制造地位,有必要采用飞秒激光钻孔。
In this paper,the development and progress of high frequency signal transmission to PCB's "hole","line" and "layer" are summarized.At present and in the future,PCB"hole"processing and quality will dominate the manufacturing position,so it is necessary to use femtosecond laser drilling.
出处
《印制电路信息》
2020年第1期47-51,共5页
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