密集散热区PTH孔问题研究

Study on PTH in dense Heat dissipation Zone

现有PCB局部散热技术主要是通过局部埋铜块或局部设计密集孔来实现散热。在电镀时由于密集孔区域与稀疏孔区域,存在明显的电位差,导致传统电镀方法及电镀线很难满足要求。文章主要通过设计不同的方法来验证并改善局部密集散热区域PTH镀铜品质问题。

The existing technology mainly achieves heat dissipation by local embedded copper coin or locally design dense holes for PCB.Due to the obvious potential electrical difference between dense hole area and sparse hole area,it is difficult to meet the requirements by traditional electroplating method and electroplating line.In this paper,different methods are designed to verify and improve the copper plating quality of PTH holes in local dense heat dissipation zone.