化学镀银板剥银后铜面产生微空洞的研究

Study on Microvoids on Copper Surface after Ag-fading

化学皱银工艺已经成为印制电路板主要的最终表面处理方式之一,在制程中化银板的主要报废有腐蚀、露铜、离子污染、微空洞。文章重点研究泊是在剥离银后,铜面微空洞的产生原因和预防控制手段。

Silver precipitation process has become one of the main final surface treatment methods of printed circuit boards.In the process,the main discarded silver boards are corrosion,copper exposure,ion pollution and microvoids.This paper focuses on the causes of micro-voids and prevention and control measures after silver stripping.