摘要
化学镀镰/金具有优良的性能,已在印制电路板上获得广泛应用。但随着线路的线宽线距越来越小耙催化剂会夹杂在线路之间造成化学镀镖经常出现超镀现象,使化学镀腺/金工艺无法应用。为了解决此问题,我们发现用0.2μm厚的微碱性化学镀银层具有化学镀镖/金层相同的可焊性和打线功能,证明微碱性化学镀银工艺可以取代超高密度PCB的化学镀牒/金工艺。
Electroless nickel plating/gold has excellent functions.Now it has been widely used in PCB,but with the development of the line width and line spacing are getting smaller and smaller,especially when the palladium catalyst will be mixed between the lines,the over plating phenomenon of electroless nickel plating is often caused by the palladium catalyst,so the electroless nickel/gold process can not be used.In order to solve this problem,the author found that the 0.2μm thick weak alkaline electroless silver deposit has the same solderability and wire function as the electroless nickel plating/gold layer.The results show that the weak alkali electroless silver plating process can replace the electroless nickel/gold plating process in ultra high density PCB.
出处
《印制电路信息》
2020年第1期60-63,共4页
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