有机电解质片式钽电容器稳定性的提高

Improvement of stability of organic solid electrolyte chip tantalum capacitors

新一代信息技术的发展不仅要求有机固体电解质片式钽电容器的等效串联电阻(ESR)小,更需要在严酷环境中使用时电容量、ESR和漏电流保持稳定。影响钽电容器稳定性的影响因素很多,其中界面稳定性是关键因素之一。为此,在此类电容器生产中引入一种新的界面预处理方法,即在介质氧化膜表面涂敷硅烷偶联剂预涂层,抑制介质氧化膜-聚合物界面的劣化。经过高低温、浪涌电压和125℃-2000 h寿命测试,静电容量、漏电流和ESR的稳定性有明显改善。试验结果表明,该界面预处理技术是制造高稳定性高压有机钽电容器非常有效的方法。

The new electronic information technology development requires organic solid electrolyte chip tantalum capacitors not only with reduced ESR levels,but also with improved ESR,capacitance and leakage currents stability against harsh environmental conditions.For this purpose,a novel interface process step was used in the production of the tantalum capacitors,high-low temperature screening,surge voltage and 125℃-2000 h life test demonstrate a significant stability improvement of the capacitance,ESR and DC leakage currents.These results show the new process is a promising technique for highly reliable capacitor production.