电磁场对锦纶织物化学镀铜的影响

Effect of electromagnetic field on electroless copper plating of polyamide fabric

采用自制通电线圈作为磁场来源对锦纶织物化学镀铜,镀液配方和工艺条件为:五水合硫酸铜5~10 g/L,酒石酸钾钠10~20 g/L,乙二胺四乙酸20~40 g/L,亚铁氰化钾1~3 mg/L,2,2′−联吡啶2~5 mg/L,聚乙二醇10~50 mg/L,乙醛酸3~5 g/L,温度40~50°C,pH 12~13,时间20 min。通过改变电流来控制电磁场强度,以研究磁场强度对镀铜层方块电阻、微观形貌、元素成分和结合力的影响。当制造电磁场的电流为30 mA时,所得化学镀铜层无杂质,表面平整,方块电阻约为17 mΩ,结合力良好。

Electroless copper plating was conducted on the surface of polyamide fabric under magnetic field created using a home-made electric wire coil.The bath composition and process conditions are as follows:copper sulfate pentahydrate 5-10 g/L,potassium sodium tartrate 10-20 g/L,ethylenediaminetetraacetic acid 20-40 g/L,potassium iron(II)cyanide 1-3 mg/L,2,2′-bipyridine 2-5 mg/L,polyethylene glycol 10-50 mg/L,glyoxylic acid 3-5 g/L,temperature 40-50°C,pH 12-13,and time 20 min.The effect of electromagnetic density controlled by the applied current on the square resistance,micromorphology,elemental composition,and adhesion of copper coating was studied.The copper coating electrolessly deposited at a current of 30 mA was impurity-free,smooth,well-adhered,and had a square resistance of 17 mΩ.