小型化收发组件结构设计

Miniaturized T/R Module Structure Design

论述了一种小型化收发组件结构设计方案,在电性能、散热、环境适应性等方面进行了结构设计和分析。通过ANSYS仿真平台对组件进行了热仿真与随机力学仿真,并给出了组件在正常工作时的实测温度及随机振动试验结果,并对仿真结果进行了验证,提高了收发组件的小型化一次设计成功率。

The paper presents a structural design of a miniaturized T/R module,which is designed and analyzed in terms of electrical performance,heat dissipation and environmental adaptability.The thermal and random vibration simulations were carried out by ANSYS simulation platform,the module working temperature and random vibration test results were given out,and the simulation results were verified,which improved the primary design success rate of the miniaturized T/R module.