硅基板芯片的电子封装结构优化方法研究

Research on Optimization Method of Electronic Packaging Structure for Silicon Substrate Chip

随着电子产品微型化的快速发展,电子封装技术成为电子工业中的关键制造技术之一。本文阐述了现有封装技术,从引线框架制作、载芯板制作、塑封料选择等方面提出了改进措施,并从结构的角度提出了相应的优化措施,可以有效地解决半导体器件分层问题,提高现有产品的良品率。

With the rapid development of miniaturization of electronic products,electronic packaging technology has become one of the key manufacturing technologies in the electronics industry.This article describes the existing packaging technology,proposes improvement measures from the aspects of lead frame fabrication,core carrier fabrication,and plastic packaging material selection,and proposes corresponding optimization measures from a structural perspective,which can effectively solve the delamination problem of semiconductor device and improve the yield of existing products.