期刊文献+

反演法求小麦面团在冻结温度范围内的热导率 被引量:3

Thermal Conductivity of Wheat Dough Determined by an Inversion Method within Freezing Temperature
下载PDF
导出
摘要 为确定小麦面团在冻结温度范围内的热导率,采用差式量热扫描法测量了3个不同水分含量面团的比热,然后利用COMSOL软件反演求出面团在-30~30℃范围内的热导率。结果表明,面团热导率随水分含量增大(38%~44%)而逐渐升高;且随着温度的降低,面团的热导率逐渐降低,但是当面团的温度降至冰点后,面团的热导率急剧上升,然后又呈缓慢上升趋势。通过对面团热导率与水分含量关系的进一步分析,建立了速冻温度范围内面团热导率随温度和水分含量变化的数学模型。 The specific heats of three doughs with different moisture contents were measured using differential scanning calorimetry( DSC) in order to determine the thermal conductivity of wheat dough within the freezing temperature.Their thermal conductivity within the temperature range of -30℃ to 30℃ was derived using an inverse optimization in the COMSOL software.The results showed that the thermal conductivity increased gradually when the moisture content of the dough increased from 38% to 44%.With the decrease of temperature,the thermal conductivity of the dough gradually decreased. However,the thermal conductivity of doughs rose sharply when the dough temperature dropped just beyond the freezing points,and then slowly increased.Through further analysis of the relationship between thermal conductivity and moisture content of dough,a mathematical model was established for predicting the thermal conductivity of a dough from its temperature and moisture content in the range of quick freezing temperature.
作者 李望铭 赵学伟 张艳艳 张华 范雯 LI Wang-ming;ZHAO Xue-wei;ZHANG Yan-yan;ZHANG Hua;FAN Wen(Food and Bioengineering Department,Zhengzhou University of Light Industry,Zhengzhou 450002,China;Collaborative Innovetion Centet for Food Production and Safety,Henan Province,Zhengzhou 450002,China;Key Laboratory for Quality and Safety Control of Cold Chain Food,Zhengzhou 450002,China;Zhengzhou Synear Food Co.,Ltd.,Zhengzhou 450011,China)
出处 《食品工业科技》 CAS 北大核心 2020年第1期1-5,11,共6页 Science and Technology of Food Industry
基金 “十三五”国家重点研发计划子课题(218YFD0400604-02) 2017年郑州市重大科技专项(174PZDZX576)
关键词 面团 热导率 反演法 比热 冷冻 dough thermal conductivity inversion method specific heat capacity freezing
  • 相关文献

参考文献7

二级参考文献79

  • 1Thome S. Mathematical Modelling of Food Processing Operations [M]. London: Elsevier Applied Science, 1992
  • 2Gupta T R. Thermal conductivity of Indian unleavened fllat bread (chapati) at various stages of baking[J]. J. Food Proc Eng, 1993, 16:227-235
  • 3Kumcuoglu S, Tavman S, Nesvadba P, et al. Thermal conductivity measurements of a traditional fermented dough in the frozen state[J]. J. Food Eng, 2007, 78:1079- 1082
  • 4seruga B, Budzaki S. Determination of thermal conductivity and convective heat transfer coefficient during deep fat frying of "Krostula" dough[J]. Eur Food Res Technol, 2005, 221:351- 356
  • 5seruga B, Budzaki S, Ugarcic- Hardi ?, et al. Effect of temperature and composition on thermal conductivity of "Mlinci" dough[J]. Czech J. Food Sci, 2005, 23:152- 158
  • 6Zanoni B, Peri C, Gianotti R. Determination of the thermal diffusivity of bread as a function of porosity[J]. J. Food Eng, 1995, 26: 491- 510
  • 7Goedeken D L, Shah K K,Tong C H. True thermal conductivity determination of moist porous food materials at elevated temperatures[J]. J. Food Sci, 1998,63:1062- 1066
  • 8Tou K, Suzuki I, Tadano T. Study of the difference of the effective thermal diffusivity between the baking dough and baked product on the white [ J ]. Bull. Coll. Agr. & Ver. Med., Nihon Uni. 1995, 52:175- 179
  • 9Strecker T D, Cavalieri R P, Pomeranz Y. Wheat gluten and glutenin thermal conductivity and diffusivity at extruder temperatures[J]. J. Food Sci, 1994, 59:1244- 1250
  • 10Sumnu G, Datta A K, Sahin S, et al. Transport and related properties of breads baked using various heating modes[J]. J. Food Eng., 2007, 78:1382- 1387

共引文献63

同被引文献23

引证文献3

二级引证文献2

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部