基于MEMS器件的玻璃通孔内金属批量化填充制备

Metal Mass Filling in Glass Through Via Based on MEMS Device

基于TGV(玻璃通孔)工艺实现圆片级真空封装的导线互联过程中,进行批量化的玻璃通孔金属填充是产品制备的必然选择。调研了玻璃加工的刻蚀技术,确定使用喷砂工艺制备通孔,基于孔径和形貌设计了两种电镀方案均实现了金属对孔的密封,通过比较2次电镀的时间和形貌,最终确定了双面溅射种子层进行电镀的方案,实现了批量化的TGV工艺制备。

In the process of connecting wires of wafer level vacuum packaging which based on through glass via process,batching of through glass via metal filling is inevitable choice of preparation of product.The techniques of glass processing were investigated and the through via were prepared using sand blasting process.There were two electroplating schemes which were both designed based on aperture and morphology and achieved the holes sealing using metal.By comparing the time and morphology of two electroplating,plating scheme of double sputtering seed layer was determined and preparation process of through glass via batch production was achieved.