聚合物/新型导热填料复合电介质的研究进展

Research Progress in Novel Composite Dielectrics Based on Polymers and Thermally Conductive Fillers

综述了非常规新型导热粒子如纳米金刚石、碳化物、铁电陶瓷及其他无机功能粒子及其填充聚合物电介质的最新研究进展,重点探讨了新型导热粒子的含量、表面改性、加工方式等对聚合物复合材料的导热及介电性能的影响。介绍和分析了基于有机分子晶体为连续声子传递通路改性聚合物导热性能的研究及机理;在基体树脂内利用无机导热粒子及有机分子晶体可构筑连续的声子导热通路,从而达到降低界面热阻、提高体系热导率的目的。相比传统导热粒子,新型导热粒子在提高绝缘聚合物热导率的同时,还赋予体系其他物理性能如磁性、优良介电性能及储能等性能。

This paper reviewed the latest research progress in novel composite dielectrics based on polymers and thermally conductive fillers and analyzed the effects of several novel inorganic nanoparticles and their content,surface modification and processing methods on the thermal conductivity and dielectric properties of the composite dielectrics.These nanoparticles include nanosized diamond,carbide silicone,ferroelectric ceramics and other inorganic functional particles.Moreover,the paper also introduced some types of organic molecular crystals which could improve the thermal conductivity of polymers by constructing a continuous way for phonons.The continuous thermal conduction pathways for phonon transfer could be constructed in the matrix by use of novel inorganic particles and organic molecular crystals,thus leading to the suppression of interfacial thermal resistance and the improvement of thermal conductivity.Compared to the thermally conductive particles used commonly,the novel thermally conductive particles not only can improve the thermal conductivity but also can enhance other physical properties such as magnetism,excellent dielectric properties and energy storage of the composites.