摘要
分别以Ti/Si/2TiC混合粉体和Ti3SiC2单相粉体作为结合剂原料,采用放电等离子体烧结技术合成了TiC/Ti3SiC2结合剂金刚石复合材料,探讨不同的结合剂原料和保温时间对TiC/Ti3SiC2结合剂金刚石复合材料的物相构成、微观形貌以及磨削性能的影响。结果表明:采用Ti/Si/2TiC为结合剂原料,保温1 min时,会形成较多量的Ti3SiC2,Ti3SiC2基体与金刚石结合良好,二者之间没有孔隙;当保温5 min时,Ti3SiC2发生分解,基体主相转变为TiC,同时有一定量的Si,金刚石表面被侵蚀,形成凹凸不平的表面。采用Ti3SiC2为结合剂原料时,Ti3SiC2基体发生严重的分解,生成TiC和Si;金刚石与基体间存在一个过渡层,厚度约15μm。Ti/Si/2TiC为结合剂原料保温1 min时试样的磨耗比值最大,为1128。单相Ti3SiC2为结合剂的2个试样的磨耗比值约为100左右。
TiC/Ti 3 SiC 2 bonded diamond composites were fabricated by spark plasma sintering using Ti/Si/2TiC and Ti 3 SiC 2 powders as binder materials.Effect of binder material and holding time on the phase composition,microstructure and grinding properties of composites were studied.The result shows that there forms amounts of Ti 3 SiC 2 when using Ti/Si/2TiC as binder with a holding time of 1 min,and the TiC/Ti 3 SiC 2 bond has a good bond with diamond with no pores.When the holding time is 5 min,Ti 3 SiC 2 decomposes and the main phase of the matrix is transformed to TiC and a certain amount of Si.The diamonds are etched then to form uneven surface.When Ti 3 SiC 2 is used as the binder,the composite decomposes seriously to form TiC and Si.There is a transition layer with a thickness of about 15μm between diamond and the matrix.In conclusion,the grinding ratio of the sample from Ti/Si/2TiC binder with a holding time of 1 min reaches the maximum value of 1128,while the grinding ratios of the samples from Ti 3 SiC 2 binder with holding time of 1 min or 5 min were about 100.
作者
张玲杰
张旺玺
梁宝岩
ZHANG Lingjie;ZHANG Wangxi;LIANG Baoyan(Materials and Chemical Engineering School,Zhongyuan University of Technology,Zhengzhou 450007,China;Henan International Joint Laboratory of Engineering of Diamond Technology,Zhengzhou 450007,China)
出处
《金刚石与磨料磨具工程》
CAS
北大核心
2020年第1期46-49,共4页
Diamond & Abrasives Engineering
基金
国家自然科学基金项目(51864028)
