偏压对磁控溅射TiN涂层微观结构及性能的影响

Microstructure and Mechanical Properties of TiN Coatings Deposited by HPPMS at Different Bias Voltages

采用高功率脉冲磁控溅射技术在GH169高温合金表面沉积了TiN纳米涂层,利用XRD、SEM、纳米压痕仪等研究了负偏压对涂层的晶体结构、表面形貌、涂层厚度及力学性能的影响。结果表明:随着负偏压从50 V增加到200 V,TiN(111)晶面择优取向,涂层晶粒细化,致密度增加,表面粗糙度减小,涂层沉积速率降低(涂层厚度减小),涂层硬度和弹性模量呈现先减小后增大再减小的趋势,而膜基结合强度则是先增加后降低。当负偏压为150 V时,TiN涂层晶粒尺寸最小,致密度最好,综合力学性能最佳。

TiN nano-coating was deposited on the surface of GH169 superalloy by high-power pulsed magnetron sputtering.The effects of negative bias voltage on the surface morphology,coating thickness,crystal structure and mechanical properties of the coating were investigated by XRD,SEM and nanoindenter.The results showed that as the negative bias voltage increases from 50 V to 200 V,the coating grain was refined,the density was increased,the surface roughness was reduced,the coating deposition rate was reduced(the reduced coating thickness),and the grains showed a preferential orientation along the TiN(111)crystal plane.The coating hardness and elastic modulus showed a similar tendency that they decreased first,then increased and then decreased,while the film-substrate bond strength increased first and then decreased.When the negative bias voltage was 150 V,TiN coating had the smallest grain size,the highest density,and the best comprehensive mechanical performance.