钛表面铜离子注入对细菌和细胞行为的影响

Titanium Modified by Copper Ion Implantation: Anti-bacterial and Cellular Behaviors

医用钛及其合金被广泛用作骨组织替换材料,但缺乏抗菌性,易导致细菌感染。铜具有良好的抗菌性能,将其引入到钛表面,可改善医用钛的抗菌性能;然而铜含量过高对细胞具有毒性。因此,需要调节铜的含量,实现铜的抗菌性能和细胞相容性之间的平衡。本研究采用等离子体浸没离子注入技术对医用钛进行表面改性,获得表面含铜量不同的样品,并研究改性钛表面对细菌和细胞行为的影响。结果表明,钛表面含铜量较低的样品能够促进大鼠骨髓间充质干细胞(rBMSCs)和人脐静脉内皮细胞(HUVECs)的增殖,但对大肠杆菌和金黄色葡萄球菌没有抑制能力;随着离子注入时间的延长,钛表面含铜量较高的样品抗菌能力显著提高,同时也未产生明显细胞毒性。因此,通过控制钛表面的铜含量,可以获得兼具良好抗菌性能和生物相容性的钛植入材料。

Titanium and its alloys have been wildly used as bone implants.However,it is still facing a severer issue:implant related infections due to the lack of antibacterial ability.Copper(Cu)has good antibacterial ability and can be used to improve the anti-infection capability of titanium.In this study,three kinds of Ti samples with different contents of Cu in the modified layer were prepared by plasma immersion ion implantation(PIII)technology,and their responses to bacteria and cells were explored in vitro.The results showed that the sample with low Cu content at the surface could promote the proliferation of rat bone marrow mesenchymal stem cells(rBMSCs)and human umbilical vein endothelial cells(HUVECs)but not inhibit the proliferation of Escherichia coli(E.coli)and Staphylococcus aureus(S.aureus).As the implantation time extends,antibacterial ability of the samples with high Cu content at the surface was significantly enhanced,and no obvious cytotoxicity was observed.Therefore,it is possible to acquire a balance between antibacterial ability and biocompatibility of Ti by controlling the contents of Cu in the modified layer.