封装壳体对高功率器件散热特性影响研究

Study of the Heat Transfer Characteristics of T/R Shell to High Powered GaN Device

针对T/R组件典型封装结构,分析了冷板构型和壳体厚度等参数对组件热性能的影响。结果表明,当壳体厚度大于1.5 mm时,当壳体热阻成为影响散热的主要因素,且通过加入高导热材料可以有效提升芯片和组件的散热能力。

In this paper,the influence of the construct of the cold-plate and the thickness of the T/R shell is studied based on the typical package structure.The results show that the thermal resistance of the T/R shell becomes the major factor in influencing the thermal performance when its thickness is larger than 1.5 mm.Also,we proposed a feasible way that utilizing heat spreading material in the module to improve the thermal performance.