铜线键合设备焊接一致性探索

Exploration of Bonding Consistency for Copper Wire Binder

相对于传统金线键合,铜线键合设备焊接过程工艺窗口更小,对焊接的一致性要求更高。通过对铜线键合工艺窗口的影响因素进行分析,探索了设备焊接过程的影响和提升办法,为铜线键合技术的推广应用提供技术指导。

Compared with traditional gold wire bonder,copper wire bonder has smaller process window and higher requirements for binding consistency.In this paper,the influence factors of copper wire bonding process window are analyzed to explore the influence of equipment consistency and improvement methods,and to provide a technical guidance for the promotion and application of copper wire bonding.