无溶剂浸胶制备玻纤布半固化片工艺研究

Study on preparation of glass fiber cloth prepreg by solvent-free dipping

以双酚A型环氧树脂和邻甲酚醛环氧树脂复配作为基体树脂,双氰胺为固化剂,咪唑2E4MZ为促进剂,无溶剂法浸胶制备玻纤布半固化片。探讨了基体树脂和促进剂对半固化制备工艺的影响,着重研究了无溶剂法玻纤布浸胶工艺和半固化片制备工艺。研究结果表明:当w(双酚A型环氧)=15%、w(酚醛环氧704)=75%、w(双氰胺)=10%(相对于浸胶总质量而言),w(2E4MZ)=6%(相对于双氰胺质量而言),涂布机温度为110℃下浸胶可达到完全浸润玻纤布;半固化工艺为130℃/9 min时,可得到具有高的分解温度(360℃)、玻璃化转变温度(165℃),耐浸焊性时间长(242 s),击穿电压(46 kV)、介电常数(4.35)、剥离强度(1.45 N/mm)优异的玻纤布半固化片覆铜板。

Using bisphenol A epoxy resin and o-cresol formaldehyde epoxy resin as matrix resin,dicyandiamide as curing agent,imidazole 2 E4 MZ as accelerator,the glass fiber cloth prepreg was prepared by solvent-free dipping process. The influence of matrix resin and accelerator on the semi-curing preparation process was discussed,and the solvent-free dipping process of glass fiber cloth and the preparation process of prepreg were mainly studied. The research results showed that when w(bisphenol A epoxy)=15%,w(phenolic epoxy 704)=75%,w(dicyandiamide)=10%(relative to the total mass of dipping glue),w(2 E4 MZ)=6%(relative to the mass of dicyandiamide),and when the coating machine temperature was 110 ℃,the glass fiber cloth could be fully impregnated with the dipping glue. When the semi-curing process was 130 ℃/9 min,the glass fiber prepreg copper clad laminate was obtained with high decomposition temperature(360 ℃),glass transition temperature(165 ℃),long soldering resistance time(242 s),and excellent performance of breakdown voltage(46 kV),dielectric constant(4.35)and peel strength(1.45 N/mm).