高纯铜靶材微观组织与取向的EBSD分析

EBSD analysis on microstructure and orientation of high purity copper targets

将99. 99%的高纯铜靶材进行了600℃、55%变形量的热轧,并分别在280、300和320℃退火2 h;采用EBSD技术对不同退火温度高纯铜靶材的晶粒尺寸、取向分布和孪晶等的演变进行了研究。结果表明:在600℃进行轧制,晶粒可充分破碎,相对于280℃退火,320℃退火的晶粒更为均匀,其孪晶含量降低了14%;轧制过程中,高纯铜易于形成<311>取向,随退火温度从280℃升高到320℃,<311>取向逐渐降低,<110>取向呈现出增强的趋势。说明320℃退火有利于得到均匀细小的晶粒、较低的孪晶含量和趋于一致的取向分布。

The 99. 99% high purity copper target was hot rolled at 600 ℃ with 55% deformation and annealed at 280,300 and 320 ℃ for 2 h,respectively. The evolution of grain size,orientation distribution and twins of the high purity copper target at different annealing temperatures were studied by EBSD technique. The results show that the large grains in the copper target are fully broken by rolled at 600 ℃.The annealing at 320 ℃ leads to more uniform grains and less twin content by 14% than that at 280 ℃.The < 311 > orientation of the high purity copper target can form easily during rolling,and tends to decrease when the annealing temperature rising from 280 ℃ to 320 ℃,while the < 110 > orientation tends to increase. Therefore,the 320 ℃ annealing temperature is beneficial to obtain uniform and fine grains,a lower twin content and uniform orientation distribution.