硫脲增强苯并三氮唑对Cu的防腐作用研究

Effect Thiourea Addition on Corrosion Inhibition of Benzotriazole for Copper Plate

通过电化学、场发射扫描电子显微镜(SEM)、接触角测试和X射线光电子能谱(XPS)等实验方法,研究了苯并三氮唑(BTAH)中加入硫脲(TU)对Cu在3%(质量分数)NaCl腐蚀溶液中的缓蚀效果。电化学实验结果表明:在加入0.50 mmol/L TU到含BTAH的体系中时,显著降低Cu在3%NaCl腐蚀溶液中的腐蚀电流密度,提升了电荷转移电阻,抑制效率提高到94.01%。SEM结果显示,在加入0.50 mmol/L TU后,Cu表面网状结构明显,表面对水接触角增大至92.6°。XPS结果显示,加入0.50 mmol/L TU后,Cu含量下降,说明表面的保护膜增厚,提升保护效果。

The effect of thiourea(TU)addition to benzotriazole(BTAH)as a mixed inhibitor on corrosion inhibition for Cu-plate in 3%(mass fraction)NaCl solution was investigated by using electrochemical methods,scanning electron microscopy(SEM),contact angle and X-ray photoelectron spectroscopy(XPS).Results show that when 0.50 mmol/L TU is added to the BTAH containing medium,the corrosion current density of Cu-plate in 3% NaCl corrosion solution is significantly reduced,and the charge transfer resistance is improved,and the inhibition efficiency reached to 94.01%.After the test,a network-like oxide film was obviously emerged on the Cu surface,thereby,on which the static contact angle of water increased to 92.6°,in the meanwhile,the Cu-content on the top of the film on Cu-plate decreased,which indicated that the surface protective film was thickened and the protective effect was improved.