摘要
通过研究不同B2O3含量的光敏微晶玻璃,获得了介电常数最小值为5.1和介电损耗达到最小值为5.7×10-3(1GHz)的光敏玻璃样品,分别对应B2O3含量为2wt%和0。通过红外光谱分析发现,B2O3以[BO3]式进入玻璃硅氧网络,会一定程度破坏网络结构,链状的[BO3]使玻璃网络变得更加疏松,最终导致玻璃的介电常数和介电损耗上升,介电性能下降。为提高玻璃的介电性能,降低介电损耗,应尽量避免硼元素的引入。
In this paper,by researching photosensitive glass-ceramics with different B2O3 content,samples with a minimum dielectric constant of 5.1 and a minimum dielectric loss of 5.7×10-3(1 GHz)are obtained,with B2O3 content of 2wt%and 0 respectively.Through infrared spectrum analysis,it is found that B2O3 enters the glass silicon-oxygen network in the form of[BO3],which will destroy the network structure.The chain-shaped[BO3]makes the glass network more loose,and eventually results in the raise of dielectric constant and dielectric loss of the glass.In order to improve the dielectric properties of glass and reduce the dielectric loss,the introduction of boron should be avoided as much as possible.
出处
《中国建材科技》
2020年第1期60-62,共3页
China Building Materials Science & Technology
关键词
光敏微晶玻璃
介电常数
介电损耗
photosensitive glass-ceramics
dielectric constant
dielectric loss
