IGBT模块的封装技术分析

Analysis of Backend Technology for IGBT Module

功率半导体模块封装是加工过程中一个非常关键的环节。分析传统模块封装技术,新型模块封装技术方案。研究适合国内芯片的封装工艺,通过协同设计提高芯片封装良品率和可靠性。

Power semiconductor module packaging is a very important part in the process.This paper analyzes the traditional module packaging technology and the new module packaging technology.It studies the packaging technology suitable for domestic chips,and improves the yield and reliability of chip packaging through collaborative design.