基于选择性激光烧结的结构电路一体化技术研究

Preparation of Intergrated Structure and Circuit Based on Selective Laser Sintering

为了实现结构电路一体化部件的快速制造,本文提出将增材制造技术与结构电路一体化技术相结合。传统结构电路一体化工艺基于注塑成形技术,成本高、周期长,难以实现快速制造与迭代设计。本文提出基于选择性激光烧结(Selective laser sintering,SLS)技术,开展结构电路一体化的制造工艺研究,该技术具有成型速度快、精度高等特点。尝试以激光烧结方式实现成形,随后进行激光活化和化学镀。试验结果表明可以在成形件表面快速制造出具有优良导电性能的镀铜区域。

In order to realize the rapid manufacturing of the integrated components of the structure and circuit,this paper proposes the combination of the additive manufacturing and the integrated structure and circuit technology.Traditional integrated structure and circuit process is based on injection molding,which has high cost and long cycle,so it is difficult to realize rapid manufacturing and iterative design.In this paper,based on selective laser sintering(SLS),the fabrication process of integrated structure and circuit is explored.SLS has the characteristics of fast forming speed and high precision.SLS is used to realize forming,then laser activation and electroless plating are carried out.The experimental results show that the copper plating area with excellent electrical conductivity can be rapidly fabricated on the formed part surface.