红外焦平面组件封装中的皮秒激光划片工艺(下)

Picosecond Laser Dicing Process in the Packaging of Infrared Focal Plane Array Modules(Ⅱ)

在对皮秒激光划片加工所涉及的基本原理和设备进行简单介绍的基础上,对红外焦平面组件封装中常涉及的一些材料的特点及其与皮秒激光束的作用机理进行了梳理。通过优化激光参数设置提高了划片效率并保证了划片质量;通过改进工夹具避免了金属层损伤且改善了操作方便性。

Based on a brief introduction to the basic principles and equipment involved in picosecond laser dicing,the characteristics of some materials often involved in the packaging of infrared focal plane array modules and their action mechanisms to the picosecond laser beams are reviewed.By optimizing the laser parameter settings,the dicing efficiency is improved and the dicing quality is guaranteed;by improving the clamping apparatus,metal layer damage is avoided and the operation convenience is improved.