纳米单晶铜磨料磨损行为的分子动力学研究

Abrasive and Wear of Nano Single Crystal Copper:a Molecular Dynamics Simulation

目的探究在不同参数下纳米单晶铜的磨料磨损行为。方法通过构建纳米单晶铜的摩擦磨损模型,对磨粒施加不同的滑动速度、滑动距离以及外载荷,研究在不同滑动速度、滑动距离、外载荷下纳米单晶铜磨料磨损行为。结果随着磨料与单晶铜基体之间滑动速度的增加(50,100,200 m/s),基体内部缺陷减少;随着滑动距离的增大(4,8,16 nm),基体被去除的原子增多且主要集中在磨料前端;随着外载荷的增大(40,80 nN),基体内部缺陷的最大深度增大,且表面无定形原子增多。结论在不同的滑动速度、滑动距离、外载荷等参数下,主要包括基体内部缺陷和表层无定形原子的纳米单晶铜磨料磨损行为有明显差异。

The paper aims to study the effects of different parameters on the abrasive wear of nano single crystal copper.By constructing the friction and wear model of nano single crystal copper,different sliding speed,different sliding distance and different external load were applied to the abrasive particles to study the abrasive wear behavior of nano single crystal copper under different sliding speed,sliding distance and external load.It was found that with the increase of the sliding speed(50,100,200 m/s)between the abrasive and the single crystal copper substrate,the internal defects of the copper substrate were reduced.The atoms removed by the substrate increased with the increase of sliding distance(4,8,16 nm).Moreover,the atoms mainly concentrated on the front end of the abrasive.As the external load increased(40,80 nN),both the maximum depth of defects in the matrix and the number of amorphous atoms on the surface increased.Under different sliding speed,sliding distance and external load,there are obvious differences in the abrasive wear behavior of nano single crystal copper,mainly including the internal defects of the matrix and the amorphous atoms on the surface.