摘要
文章设计了WEE系统,用于晶圆的边缘曝光工艺需求。首先进行了WEE系统的硬件设计;运用最小二乘法计算得到晶圆的圆心,运用几何旋转-平移变换获得晶圆切口位置角度;构建运动控制器的正逆解运动学方程,实现曝光轨迹的圆弧、直线运动控制;通过对晶圆涂胶、曝光、烘烤、显影等工艺过程,验证晶圆边缘曝光工艺,实验结果验证了本WEE系统设计达到了标准工艺指标。
This paper designs a WEE system for wafer edge exposure process requirements.Firstly,the hardware design of WEE system is carried out,the center of wafer is calculated by least square method,and the position angle of wafer incision is obtained by geometric rotation-translation transformation,the forward and inverse kinematics equation of motion controller is constructed to realize the control of arc and straight line motion of exposure trajectory.Through the process of wafer gluing,exposure,baking and developing,the wafer edge exposure process is verified.The experimental results verify that the WEE system design meets the standard process parameters.
作者
苗涛
张军
邹春太
MIAO Tao;ZHANG Jun;ZOU Chuntai(KingSemi Co.,Ltd,Shengyang 110168,China)
关键词
边缘曝光
最小二乘法
运动控制
工艺
edge exposure
least square method
motion control
technology