表面活性剂对HEDP镀铜层致密度的影响

Influences of Surfactant on the Density of HEDP Copper Plating Layer

研究了表面活性剂对HEDP镀铜层致密度的影响。采用线性电位扫描法研究了铜电沉积的电化学行为,分别测试了镀液和基体之间的接触角、镀层的粗糙度,表征了表面活性剂的润湿及整平能力,采用XRD分析了镀层的晶粒尺寸。结果表明:表面活性剂能够增大阴极极化,并具有整平作用。且随表面活性剂含量的增加,镀液与基体表面的接触角减小,镀层无针孔,粗糙度降低并具有很高的致密度。当表面活性剂与阴极移动同时作用,镀层厚度8μm时孔隙率便可下降为0。XRD结果显示,铜镀层晶粒尺寸为47.6 nm,在(111)晶面获得高择优取向。

The influences of surfactant on the density of HEDP copper plating was studied.The electrochemical behavior of copper deposition was analyzed by linear potential sweep method,the wetting and leveling ability of the surfactant were analyzed by contact angle measurement and surface roughness measurement,the grain size of copper plating was analyzed by XRD.The results indicated that the surfactant could increase cathodic polarization and had positive effects of leveling.It could be observed that with the increase of the content of the surfactant,the contact angle of the plating solution on the surface of the sample and the roughness of copper plating surface were reduced.The plating surface was smooth and compact without pinholes.Adding the surfactant and applying cathode movement at the same time,as the coating thickness was only about 8μm,the porosity could be decreased to 0.XRD results showed that the grain size was decreased to 47.6 nm,and the(111)crystal surface was highly preferred.