核电仪控产品电路板无铅焊接技术研究

Research on Lead-free Soldering Technology of PCB for Nuclear Power Instrumentation

为推进产品绿色化,开拓国际市场,应对欧盟RoHS指令,需要推动核电仪控产品电路板无铅焊接工作;采用DOE试验对核电仪控产品的无铅材料的焊接工艺进行了研究和工艺验证,并对无铅工艺产品进行外观、金相、SEM等分析,并研究了温度、环境等对焊接质量的影响.结果表明,在使用Sn-3.0Ag-0.5Cu焊接材料、工艺曲线合适(峰值温度237℃左右,保持时间35 s左右)情况下,可以获得稳定的产品质量.

In order to promote green products and open up international markets and in response to EU RoHS directive,it is necessary to promote lead-free soldering of circuit boards of nuclear power instrument-controlled products.The lead-free soldering process of nuclear power instrument-controlled products is studied and verified by DOE test,and the inspection and analysis on appearance,metallography,SEM images of lead-free process products are conducted.Effects of temperature and environment on the welding quality are studied.It is confirmed that stable product of good quality can be obtained when the process curve for Sn-3.0Ag-0.5Cu welding material is suitable with the peak temperature about 237℃and the holding time about 35 s.